Our definition of “Standard Technology” is based on our experience.
Most projects don’t need special features and can be managed with a standardized production flow, ensuring the lead time and product reliability.
To help you to identify if your products belong to this category, we have prepared a short list of main features.
If you need more specific details, feel free to contact us and to submit your custom Gerber files to our Technical Office.
|Base Material Used||FR4 – FR4 HiTg°||FR4 140° - FR4 150° - FR4 170° - Other materials on demand|
|Layers||2 - 4 - 6 Layers||from 1 up to 16 Layers|
|Board Thickness||1.6 mm||0.8 - 1.0 - 1.2 - 1.6 - 2.0 - 2.4 mm|
|Base Copper Thickness||18 – 35 µ||18 – 35 - 70 - 105 µ|
|Minimum Diameter Hole (Mechanical)||0.2 mm||0.125 mm (Laser drilling available < 0.1 mm)|
|Holes Position Tolerance||± 0.1 mm (from the board edge)|
|Minimum Trace||150 µ||110 µ|
|Minimum Space||150 µ||110 µ|
|Plated Hole Tolerance||-0.05 up to + 0.1 mm|
|Unplated Hole Tolerance||0 up to + 0.1 mm|
|Conformity Certificate||On demand|
|Test Certificate||On all delivery|
|Certification||UNI EN ISO 9001:2008
UL Certified: 94V-0 up to 130°
|UNI EN ISO 9001:2008 - UL Certified: 94V-0 up to 130°
ISO TS 16949-2002
|Routing Tolerance||± 0.2 mm|
|Surface Finishes||H.A.S.L. – Lead Free H.A.S.L. – ENIG||H.A.S.L. – Lead Free H.A.S.L. – ENIG - Other on demand|
|Solder Mask Types||Photographic/LDI - Green|
|Electrical Test (short and open)||100%|