| SPECIFICATIONS | STANDARD | ADVANCED | ENGINEERING |
|---|---|---|---|
| Base Material Used | FR4 Std; FR4 Mid TG° /Mid TG° HF; FR4 HiTg° (ITEQ, ISOLA, HITACHI); High Speed (NELCO 4000-1 (SI); ISOLA FR408HR / ASTRA / I-TERA; PANASONIC Megtron 6 / Megtron 7) | ARLON 33N / 35N / 85N / 85HP; HITACHI MCL-I-671; VENTEC VT901; ISOLA P95/P96; ROGERS ML91/ML92; Thick Copper; Flexible Materials-Polyimide Dupont Pyralux AP/LF/FR; Flexible Material Polyimide Panasonic R-F775; Hi Frequency Teflon and non-Teflon based: Rogers/Arlon RT/Duroid Family, RO3000 family,DiClad family, Cuclad family, Isoclad family, AD family, AR family, TC family, RO4000 family; TACONIC RF25A2, RF35, RF35A2, RF45, RF60, CER10, TLX, TLY, TLE; NELTEC NY9220 | |
| PCB Type | Rigid; Rigid/Flex; Hybrid Rigid | Rigid; Flex; Rigid/Flex (hybrid); Copper/aluminium Heat Sink; Metal Coin | Rigid; Flex; Rigid/Flex (hybrid) (Teflon+Kapton) |
| Maximum Number of Layers | 16 | 40 | > 40 |
| Maximum Board Dimension | 570 x 449 mm | 640 x 570 mm | 700 x 620 mm |
| Maximum Board Thickness | 3.2 mm | 6.5 mm | |
| Minimum core Thickness | 0.1 mm | 0.05 mm – 0.025 (Flex) | |
| Base Copper Thickness | 12 – 18 – 35 – 70 µ | 9-12-18-35-70-105-140-210-315 µ | > 315 µ and < 9 µ |
| Aspect Ratio | 8:1 | 12:1 | 14:1 |
| Minimum Diameter Hole (Mechanical) | 0.150 mm | 0.127 mm | 0.100 mm |
| Minimum Diameter Hole (Laser) | 100 µ | 75 µ | 60 µ |
| Holes Position Tolerance | ± 0.1 mm (from the board edge) |
± 0.07 mm on PCB with diagonal < 300 mm (from the board edge) | |
| Minimum Trace | 100 µ | 75 µ | 50 µ |
| Minimum Space | 100 µ | 75 µ | 50 µ |
| Plated Hole Tolerance | -0.05 ÷ + 0.10 mm | -0.05 ÷ + 0.05 mm | |
| Unplated Hole Tolerance | 0 ÷ + 0.10 mm | 0 ÷ + 0.05 mm | |
| Conformity Certificate | On-demand | On-demand | |
| Test Certificate | On all delivery | On all delivery | |
| Controlled Impedance Certification | On demand | On demand | |
| Production Date (week and year) | On solder mask – On copper (on demand) | On solder mask – On copper (on demand) | |
| Certification | ISO 9001:2015 – EN 9100:2018; IATF 16949:2009; Certified: 94V-0 up to 130° |
ISO 9001:2015 – EN 9100:2018; IATF 16949:2009; Certified: 94V-0 up to 130° | |
| Routing Tolerance | ± 0.20 mm | ± 0.15 mm | |
| Surface Finishes | H.A.S.L.; Lead-Free H.A.S.L.; E.N.I.G.; Chemical Tin; OSP; Immersion Silver | Electrolytic Ni; Electrolytic NiAu; ENEPIG |
|
| Solder Mask Types | Photographic | Photographic – Different Colours | |
| Legend | White | Data Matrix; QR Code; Legend by Different Colours | |
| Electrical Test (short and open) | 100% | 100% |
