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Products

Mono/Double-sided PCBs

Double-sided PCBs are one of the most popular types of PCB. They are composed of two layers, interconnected with metalized holes (vias). They are applied in any field of electronic industry

Multilayer PCBs

Elco produces both Homogeneous (one basic material) and Composite (different base materials) Rigid Multilayer PCBs. They allow high assembly density, small sizes, and great flexibility

HDI-SBU PCBs

HDI (High-Density Interconnection) are PCBs with micro vias and fine structures. SBU (Sequential Build Up) is a sequential extension of multilayer boards for increasing the board’s reliability

Rigid/Flex PCBs

Rigid-flex circuits are a hybrid construction flex circuit consisting of rigid and flexible substrates, laminated together into a single structure. Elco rigid-flex PCBs have up to 20 layers

Flex PCBs

Flex circuits allow mounting electronic devices on flexible plastic substrates. They are ideal for tightly assembled electronic packages, where electrical connections are required in 3 axes

Aluminium PCBs

Aluminium PCBs, or metal core board or insulated metal substrate (IMS), clad with thermally conductive thin dielectric, are used for parts requiring significant cooling, such as LEDs

22 layers – 3.45 mm
Polyimide
Controlled Impedance
MIL STD

8 layers – 1.6 mm
FR4 170°
Buried Holes
MIL STD

8 layers – 1.6 mm
FR4
Blind & Buried Holes
IPC 600 Class 2

10 layers – 2.8 mm
Teflon/FR4/Teflon
Internal Cu: 18 / 105 μm
MIL STD

12 layers – 2.6 mm
FR4 + Kapton
Rigid-flex (6 flex)
MIL STD

20 layers – 3.2 mm
FR4spect Ratio 12.8:1
Controlled Impedance
STD IPC A600 class 2

Detail of blind hole
FR4 170°
Diameter: 0.3 mm
IPC A600 Class 3

18 layers – 3.0 mm
Polyimide + Kapton
Rigid Flex (6 flex)
MIL STD

6 layers – 1.2 mm
RO4350/FR4/RO4350
Controlled Impedance
STD IPC A600 class 3

20 layers – 3.4 mm
Polyimide
Sequential Build-Up Drilling
MIL STD

Get detailed info

Check our Capabilities, download Materials Datasheets, or contact our Technical Support