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SBU PCB's
MANUFACTURING >> PRODUCTS >> SBU PCBs
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sbu.jpg A technological solution for
High-Density PCB's

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Technical Data:
Construction: Up to 32 Layers
Sequential multilayers
Base copper thickness :
5µ, 9µ, 12µ, 18µ, 35µ, 70µ, 105µ

Dimensions:
Maximum PCB size : 478 x 592 mm
Maximum thickness : 5 mm

Base Materials:
  • High Tg epoxy (Tg>175°C) compatible RoHS
  • Materials for high frequencies (4 to 15 Ghz)
  • Polyimide
  • ROGER 4350
  • Green material (halogen free)

  • Surface Finishing:
  • Electroless Nickel/Gold (ENIG)
  • Electroplated Nickel/Gold
  • Immersion tin
  • Tin Lead reflow
  • OSP
  • Line & Spacing:
    External standard : 60µ/75µ
    Internal standard : 50µ/75µ
    Internal advanced : 40µ/60µ

    Blind vias (mechanical):
    Drilling diameter : 100µ

    Thru hole:
    Min drilling diameter : 150µ
    Aspect ratio : 16:1

    Laser vias:
  • Sequential multilayers (3 levels)
  • Stacked microvias
  • Via copper filling
  • Drilling diameter : 75µ

  • BGA:
  • Up to 1980 I/O
  • Pitch : 1, 0.8, 0.65, 0.5, 0.4, 0.3 mm

  • Flip Chip:
    < 250µ pitch

    Impedance Check
  • Tolerance of impedance: ± 10 %
  • Reflectometer Polar

  • Tests
  • 100% Automatic-Optical-Inspection
  • 100 % electrical test
  • Visual inspection

  • Quality Controls
  • Guarantee of custom-designed quality standards and production according to international guidelines:
  • Vision 2000 - CNES - AS9100B
  • EN9100:2003/S1
  • JISQ9100:2004
  • UL Certified: 94V-0 up to 130°
  •