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Elco S.p.A
Via Turanense Km. 44,82
67061 - Carsoli (AQ)
Tel: +39 0863 90641
Fax: +39 0863 9064334
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Multi-Layer PCBs
MANUFACTURING >> PRODUCTS
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multilayer.jpg Elco produces both Homogeneous and Composite Rigid Multilayer PCBs
 
Homogeneous: Rigid multilayer circuit boards composed of the same basic material

Composite: Rigid multilayer circuit boards composed of different base materials

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Technical Data:
Construction
Up to 38 layers (under consideration of the maximum pcb thickness) Standard base copper thickness: 18 μm, 35 μm, 70 μm, 105 μm

Base Material FR4 Std Tg 135°
FR4 Medium Tg > 150°
FR4 Hi Tg > 175°
Polyimide Teflon substrates (Special materials on request)

Dimensions
Maximum pcb size
25.2" x 22.4" (640 x 570 mm)

PCB Thickness Maximum pcb thickness: 0.26" (6.5 mm)
Minimum pcb thickness: 0.12" (0.3 mm)

Surfaces Finishing
  • Organic copper-passivation
  • Hot air levelling (HASL) (depends on thickness and size)
  • Electroless nickel/gold (NiAu)
  • Electroplated nickel/gold (NiAu)
  • Tin Lead reflow Other surfaces on request
  • Solder Masks:
  • Screen printing of solder mask (uv-drying)
  • Peelable solder mask

  • Special Printings:
  • Carbon
  • Marking print

  • : Track Width/Space:
    Standard : 100 µm
    High-Tech: 75 µm
    Next step: 50 µm

    Drill Diameter (mechanical):
    Standard : 200 µm
    High-Tech: 150 µm
    Next step: 75 µm

    Microvia Technology:
    (laser drilled blind via)
    Standard Drill Diameter: 75 µm
    Aspect ratio: ≤ 1

    Contour Processing:
  • Milled
  • Scored (contour or perforation)
  • Impedance Check
  • On request
  • Tolerance of impedance: ± 10 %

  • Tests
  • Automatic-Optical-Inspection (depending on layout and surface)
  • 100 % electrical test
  • Special check on request
  • Visual inspection

  • Quality Controls
  • Guarantee of custom-designed quality standards and production according to international guidelines:
  • Vision 2000 - CNES - AS9100B
  • EN9100:2003/S1 - JISQ9100:2004
  • UL Certified: 94V-0 up to 130°
  •