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Elco S.p.A
Via Turanense Km. 44,82
67061 - Carsoli (AQ)
Tel: +39 0863 90641
Fax: +39 0863 9064334
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Heat-Synk PCBs
MANUFACTURING >> PRODUCTS
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heat-synk.jpg PCBs with Heat-Synk technologies applied
(Invar: Internal - Aluminium/Copper: External)

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Technical Data:
Construction Up to 32 layers (under consideration of the maximum pcb thickness) or double-sided copper-claded material for 2 layer boards standard copper-claddings: 18 μm, 35 μm, 70 μm, 105 μm

Base Material FR4 Std Tg 135°
FR4 Medium Tg > 150°
FR4 Hi Tg > 175°
Polyimide (Special materials on request)

Heatsink
  • Thermal conductive materials (metals, preferably copper, aluminium) in heatsink form (on pcb) or metal core (in pcb)

  • Dimensions
    Maximum pcb size
    (multilayer): 25.2" x 22.4" (640 x 570 mm)
    PCB Thickness
    Maximum pcb thickness: 0.26" (6.5 mm)
    Minimum pcb thickness: 0.004" (0.1 mm)

    Heatsink Thickness:
    0.004" - 0.16" (0.1 - 4 mm)
    (referring to the solid thickness)

    Drill Diameter (mechanical)
    Standard : 200 µm
    High-Tech: 150 µm
    Next step: 75 µm

    Surfaces Finishing
  • Organic copper-passivation
  • Hot air levelling (HASL)
  • Electroless nickel/gold (NiAu)
  • Electroplated nickel/gold (NiAu)
  • Tin Lead reflow Other surfaces on request

  • Solder Masks
  • Screen printing of solder mask (uv-drying)
  • Peelable solder mask
  • Special Printings
  • Carbon
  • Marking print

  • Contour Processing
  • Milled
  • Scored (contour or perforation)

  • Impedance Check
  • On request
  • Tolerance of impedance: ± 10 %

  • Tests
  • Automatic-Optical-Inspection
  • 100 % electrical test
  • Special check on request
  • Visual inspection

  • Quality Controls
  • Quality standards and according to international guidelines:
  • Vision 2000 - CNES - AS9100B
  • EN9100:2003/S1 - JISQ9100:2004
  • UL Certified: 94V-0 up to 130°
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